Packaging
We offer the highest quality, most economicallypriced static shield packaging available. With 40% light transparency, itallows for easy identification of IC's (integrated circuits) and PCB's (printedcircuit boards). The extremely durable buried metal contruction gives FaradayCage performance needed to effectively shield these componenets against staticcharge.
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
We can offer worldwide express delivery service, such as DHLor FedEx or TNT or UPS or other forwarder for shipment.
Global Shipment by DHL/FedEx/TNT/UPS
Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
| Shipment charges： |
(Reference DHL and FedEX) |
| Weight(KG): 0.00kg-1.00kg |
Price(USD$) : USD$60.00 |
| Weight(KG): 1.00kg-2.00kg |
Price(USD$) : USD$80.00 |
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.
- Other Shipment Way: SF Express for Asia; Chang-woo special air line for Korea, Aramexfor Middle East countries. Others more shipping way, please contact us.
We also can send the goods to your forwarder or your othersupplier, so that you can send the goods together. It may will save shipmentcharges for you, or may will more convenient for you.
- Shipping Details: Shippinginformation, We need shipping information including Receiver Company Name(Or personal), Receiver Name, Contact Number, Address and Zip Code. Please make sure these information to us, so that we can arrange the shipment faster.
- Delivery time: Deliverytime will need 2-5days to most of country all over the world for DHL/UPS/FEDEX/TNT.
TEM 3-1212N Product Details:
Title: TEM 3-1212N Power Supplies: High-Quality DC DC Converters for Board Mount Applications
TEM 3-1212N is a powerful and reliable DC DC converter designed for board mount applications. The TEM 3-1212N product model number signifies the device's specific features, such as high power conversion efficiency, excellent temperature stability, and superior output accuracy.
Main Features and Performance Parameters:
With an output voltage of 12 VDC and an output current of 1 A, the TEM 3-1212N is perfect for powering various electronic devices ranging from low power controlling systems to high-speed FPGA. The maximum power output of 12 W endows it with higher efficiency and reliability.
The converter is compliant with RoHS and REACH standards and can operate at a temperature range between -40°C to +85°C with a maximum efficiency of 86% at full load. It features input undervoltage/overvoltage protection, output overcurrent protection, and a soft-start function.
Application Scenarios and Usage:
TEM 3-1212N is compatible with several industries such as automotive, aerospace, military, medical, telecommunications, and other electronic systems. It is highly recommended for designing battery-powered systems and IoT applications due to its low power consumption and small form factor.
Types of Integrated Circuits:
Integrated circuits can be classified into digital, analog, mixed-signal, and RF. The TEM 3-1212N is an example of an analog integrated circuit, which converts an input DC voltage to a regulated 12 VDC output voltage with high precision and efficiency.
Manufacturing Process:
Producing the TEM 3-1212N involves multiple complex manufacturing processes. First, the chip design is carried out in specialized integrated circuit design software. After this, the wafer is cut into chips and cleaned thoroughly.
Next, the chip is processed through several stages, including laser processing, back grinding, doping, exposure, vapor deposition, etching, and more. Each stage is vital in achieving the desired product features and performances.
Packaging and Testing:
After the manufacturing process, the finished products are packaged appropriately and tested to ensure component quality. The testing process involves in-circuit testing, functional testing, and performance testing, among other forms of testing.
In conclusion, the characterization and performance of TEM 3-1212N reflect its quality, reliability, and high precision. The article highlights the product using essential keywords and phrases to improve its visibility and search ranking. This power supply is a perfect fit for board-mount electronic systems that demand low power consumption, small footprint, and high precision.
